FR-4 1.6mm Circuit Board Multilayer electronic board assembly
Multilayer PCB Assembly Introduction
Flexible Multilayer PCB; Rigid Flex Multilayer PCB
Multilayer PCB Assemblies have the weight and space advantages, which are extremely valuable for aerospace PCBs; multilayer PCBs are beneficial in other electronic area as well.
We have advanced equipment to handle Multilayer printed circuit board assembly services with performance, quality, and reliability our core principles. Multilayer PCBs are used in electrical devices, military equipment, healthcare apparatus, and many more.
Multilayer PCB Assemblies are used extensively in the following industries:
Aerospace, Military, Medical, Automotive, Communications, Consumer electronics, Industrial applications, Transportation, LED lighting, Business electronics etc.
PCB CAPABILITIES
FACTORY CAPABILITIES
No. Items 2020
1. HDI Capabilities: HDI ELIC(5+2+5)
2. Max layer count: 46L
3. Board Thickness: Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4. Min.Hole Size: Laser 0.05mm;Mechnical 0.15
5. Min Line Width/Space: 0.030mm/0.030mm
6. Copper Thickness: 1/3oz-6oz
7. Size Max Panel size: 700x610mm;custom
8. Registration Accuracy: +/-0.05mm
9. Routing Accuracy: +/-0.05mm
10. Min.BGA PAD: 0.125mm
11. Max Aspect Ratio: 10:01
12. Bow and Twist: 0.50%
13. Impedance Control Tolerance: +/-5%
14. Daily output: 4,000m2 (Max capacity of equipment)
15. Surface Finishing: HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16. Raw Material: FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
PCBA CAPABILITIES
| PCBA Capability |
| Material type | PCB | Components |
| Item | Dimension (Length, width,height. mm) | Material | Surface finish | Chip&IC | BGA Pitch | QFP Pitch |
| Min | 50*40*0.38 | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | HASL, OSP, Immersion gold, Flash Gold Finger | 1005 | 0.3mm | 0.3mm |
| Max | 600*400*4.2 | | |
SMT capabilities:
SMT Assembly: SMT provides a flexible high technology.
These solutions include:7 high-speed placement machines, 7 automatic printers with fiducial alignment, 2 X-ray machines, BGA maintenance machines, ICT test machines
DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.
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Multilayer PCB Assembly Process
1.Solder Paste stenciling--2.Surface Mount Technology (Pick and Place)--3.Reflow Soldering--4.Inspection and Quality Control--5.Through-Hole Component Insertion (DIP Process)--6.Final Inspection and Functional Test
Delivery Time
| Product Type | Qty | Normal lead time | Quick-turn lead time |
| SMT+DIP | 1-50 | 1WD-2WD | 8H |
| SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
| SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
| SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
| PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
| PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
| PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
| PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
| PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
| PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
| PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Electronic Board Assembly Application Field
Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.
Workshop
Common packaging
PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box
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FR-4 1.6mm Multilayer PCBA Printed Circuit Board Assembly Images
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